T13_BOPAI_64_4_t13_bopai_S012_invens_mjl_64_4_5.1_invens-Royal_Android_5.1_V01_20170419_Royal - FIRMWEAR CM2 FLASH FILE

FIRMWEAR CM2 FLASH FILE

Breaking

dulal18

Wednesday, October 10, 2018

T13_BOPAI_64_4_t13_bopai_S012_invens_mjl_64_4_5.1_invens-Royal_Android_5.1_V01_20170419_Royal


invens Royal R1 5.1 Official Firmware Pac 100% Tested



- > Wait phone connected ... 

Phone found! [ 48 ]
Port Opened
Sync...
InitBoot Done [ 0x81 ] , Ver : SPRD3
Sync...
Sending FDL
[Info] : If SW freeze here more, than 15 seconds - remove cable
FDL Ready!
Boot Ver : SC7731 Crev eMMC Loader v2.0     
Sending FLASH FDL
FLASH FDL Ready!
Boot Ok!

Model Name  : t13_bopai_S012_invens_mjl_64_4_dt
Model Brand : invens
Model Device: t13_bopai_S012_invens_mjl_64_4
AndrVersion : 5.1
BaseBand CPU: T13_BOPAI_64_4
Project Ver : invens-Royal_Android_5.1_V01_20170419
Model Ext   : Royal

[Read Mode] : HSUSB : 0x3000

[FW_READER] : Reading Firmware Now ... 

[Read Ok] : u-boot-spl-16k.bin
[Read Ok] : u-boot.bin
[Read Ok] : prodnv.img
[Read Ok] : sc7731C_CP0_modem.bin
[Read Ok] : DSP_DM_Gx.bin
[Read Ok] : nvitem_w.bin
[Read Ok] : sc8830g_modem_CP2_Trunk_W15.49.3_Release.bin
[Read Ok] : nvitem_wcn.bin
[Read Ok] : logo_480x854.bin
[Read Ok] : fblogo_480x854.bin
[Read Ok] : thirdlogo.bin
[Read Ok] : forthlogo.bin
[Read Ok] : boot.img
[Read Ok] : system.img
[Read Ok] : oem.img
[Read Ok] : sysinfo.img
[Build Ok] : cache.img
[Read Ok] : recovery.img
[Build Ok] : userdata.img

AndroidInfo created
Firmware Size : 2340 MiB
Saved to : C:\Users\GSM ALIM\Desktop\r9+\T13_BOPAI_64_4_t13_bopai_S012_invens_mjl_64_4_5.1_invens-Royal_Android_5.1_V01_20170419_Royal\
Done!
Elapsed: 00:07:48
Reconnect Power/Cable!


No comments: